Effect of Applied Potentials and Deposition Time on Electrodeposition on Stainless Steel

Abstract

Copper is widely recognized for its excellent antimicrobial properties and has been historically used to limit the spread of pathogens on high-contact surfaces. However, coating stainless steel with copper by electrodeposition presents challenges, including poor adhesion, porosity, and non-uniform layers if deposition conditions are not well controlled. This study investigates the effects of applied potentials and deposition times on copper electrodeposition to develop high-quality antimicrobial copper coatings for stainless steel surfaces, with potential applications in healthcare.