MAYAPPAN, R. The Evolution of Interfacial Intermetallic Compound Growth and Solder Joint Strength of Sn-40Pb/Cu under Thermal Aging. Scientific Research Journal, [S. l.], v. 21, n. 2, p. 57–72, 2024. DOI: 10.24191/srj.v21i2.26314. Disponível em: https://journal.uitm.edu.my/ojs/index.php/SRJ/article/view/2884. Acesso em: 5 oct. 2024.