MOHAMED, M. M. .; ATAN, R. . Three Dimensional CFD Simulations of Junction Temperature of Electronic Components Using Nano-Silver. Scientific Research Journal, [S. l.], v. 8, n. 1, p. 29–39, 2011. DOI: 10.24191/srj.v8i1.5044. Disponível em: https://journal.uitm.edu.my/ojs/index.php/SRJ/article/view/3187. Acesso em: 26 nov. 2024.