Mayappan, Ramani. “The Evolution of Interfacial Intermetallic Compound Growth and Solder Joint Strength of Sn-40Pb/Cu under Thermal Aging”. Scientific Research Journal 21, no. 2 (August 23, 2024): 57–72. Accessed October 5, 2024. https://journal.uitm.edu.my/ojs/index.php/SRJ/article/view/2884.